TSMC and UMC land Xbox 360 chip orders from Microsoft

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TSMC and UMC land Xbox 360 chip orders from Microsoft

Taiwan Semiconductor Manufacturing Company (TSMC) will manufacture the northbridge chip for Microsoft’s Xbox 360 at its 12″ wafer fabs, while rival United Microelectronics Corporation (UMC) will process the southbridge chips, according to the Chinese-language Economic Daily News (EDN). Production will start from the fourth quarter of this year.

More here at DigiTimes.

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