Qimonda receives rescue loan of $446 million

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Qimonda receives rescue loan of $446 million

Qimonda has announced that the company has arranged a financing package of $445.58 million (325 million Euro) for the ramp up of its Buried Wordline technology. The rescue package includes loans of 150 million euros from the German Free State of Saxony, 100 million euros from an unnamed financial institution in Portugal and 75 million euros from the chipmaker’s parent company Infineon Technologies.

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