Siemens, Motorola produce chips on 300mm wafers

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Siemens, Motorola produce chips on 300mm wafers

Siemens’ and Motorola’s chip fab partnership has successfully produced the world’s first fully functional chips made from 300mm wafers.

The companies manufactured the 64MB DRAM chips at a development line in Dresden, Germany. The ability to produce chips from 300mm wafers will allow the companies to reduce overall production cost per chip by about 30 percent compared to current 200mm technology. Moving to the larger wafers will enable the two companies to produce roughly 2.5 times more chips per wafer.

More information is available at http://www.siemens.com/semiconductor/index.htm and at http://sps.motorola.com.

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