Packaging slip delays PIII flip-chips

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Packaging slip delays PIII flip-chips

The 550-MHz “flip-chip” Pentium III will be delayed by about a month due to an apparent packaging error.

The flip-chip is named for the way in which the chip’s 370-pin package is mounted onto the die. Because Intel has moved the Level 2 cache onto the chip, the Single-Edge Cartridge Form Factor package can be eliminated.

Intel has reportedly told PC companies that the flip-chip form factor will be delayed until the end of February.

However, OEM and industry sources said they were relatively unconcerned over the delay, which does not affect a similar 500-MHz speed grade flip-chip, expected to be introduced on schedule at the end of January.

A full report is posted online at


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