At the Microprocessor Forum, Motorola Inc. presented its G4 PowerPC design implementing a 0.18-micron Silicon-on-insulator (SOI) technology. Advanced Micro Devices, IBM and Samsung already use SOI, that uses an insulating layer to separate the top layer of chip silicon, with its transistors, from the substrate silicon to improve chip performance and cut energy needs. Intel Corp. engineers are now saying their company is reconsidering its earlier decision, based on cost, not to adopt SOI. Reportedly, the process would be first used on the company’s mobile chips, where the power and performance formula is particularly important. AMD’s agreement with Motorola to help apply SOI technology to its 64-bit Hammer processors may have helped to push the company toward that decision.
To read the source article, go to eet.com.