Hynix rumored ready to outsource packaging and testing for own-brand DRAM modules

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Hynix rumored ready to outsource packaging and testing for own-brand DRAM modules

According to Taiwanese DRAM module assemblers, Hynix Semiconductor may soon become the first major DRAM die manufacturer to outsource packaging and testing for its own-brand memory modules. Sources say the orders may go to TwinMOS Technologies.

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