TSMC, UMC stay on FSG for low-k, 90-nm process

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TSMC, UMC stay on FSG for low-k, 90-nm process

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) are expected to keep using fluorinated silicate glass (FSG), a low-k dielectric material, for their 90-nanometer (nm) production, according to sources.

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