Next-generation Intel Nehalem CPU to increase consumption of FC substrates

  • The number of substrate layers for the next-generation Intel Nehalem-based CPU has been decided, according to industry sources, with 12 layers being the maximum, double the current number of layers. In addition, the larger substrate area is expected to increase flip-chip (FC) capacity consumption by 15-20% in 2009.

    More here at Digitimes.

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