IDF: Transition to 450mm wafers should be industry-wide, says Intel senior fellow
Although Intel would actually like to start using 450mm silicon wafers by 2011-2012, the transition should be industry-wide, said Mark Bohr, Intel senior fellow and director of process architecture and integration. Speaking at a roundtable during the Intel Developer Forum (IDF) in Beijing. Bohr noted that Intel usually strives to a wafer size conversion after every third or fourth process node generation.
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