Built-in 3/3.5G may be next big thing in notebook market

  • Communications chip suppliers are eying the huge business opportunities promised by notebooks with built-in 3/3.5G modules.

    Qualcomm has teamed up with Hewlett Packard (HP), Dell and Lenovo to launch notebooks that support CDMA 2000 1x EV-DO or High-Speed Packet Access (HSPA), while Ericsson Mobile Platforms (EMP) is also looking for partners in Taiwan's notebook sector to work on built-in 3.5G HSPA, industry observers have indicated.

    More here at DigiTimes.

Related Stories

Powerful Advice for Avoiding Distractions in the Workplace

Xiaomi Air 13 Laptop Sale + Coupon

7 Basic Tips & Tricks Every New Mac Owner Should Know