A consortium of companies including Nokia, LG, Samsung, Sony and MasterCard are to turn cell phones into mobile wallets, allowing consumers to pay for goods and services simply by swiping their phone as they would a credit card
Internet security specialist Sophos has released a report on the rise of malware in the first quarter of 2007.
Avid Technology today shed light on the latest version of its consumer video editing software, Pinnacle Studio 11.
Research in Motion is working on an emulator to make Windows Mobile based devices, such as the Palm Treo, work like a Blackberry.
SiS has announced that its SiS671FX chipset is to be used in the new Fujitsu T671ME-FJ motherboard which recently entered mass production.
Time Warner Cable struck a deal with Spanish start-up FON that will enable its high-speed Internet customers to turn their Road Runner broadband connections into public wireless hotspots.
New software from Research in Motion (RIM) will enable all BlackBerry wireless applications to run on smartphones from rival handset makers.
The good old Amiga system is could be resurfacing soon. Amiga and ACK Software Controls announced that the two firms are working on two new computers, one targeting a price point of $500 and another that will be aiming to attract performance-focused users and a budget of about $1500.
VoIP technology has proven to be the key market enabler for cable telephony services and subscriber growth, reports In-Stat.
Hitachi today announced three new hard drive models targeting the enterprise market, including a fast 15K drive, a compact 2.5” model as well as a version of its high capacity terabyte drive.
13-year-old Morgan Pozgar texted her way to the bank, pocketing the $25,000 grand prize in LG's national text messaging contest.
Following last week’s sobering financial news, AMD today provided some news that may calm down worried analysts and investors.
Akita Elpida Memory, the DRAM backend production subsidiary of Elpida Memory, announced the development of a 1.4 mm-thick multi-chip package (MCP) with 20 stacked dies, claiming it as the world's thinnest MCP.
Seoul (Korea) – Stacking is the magic word that promises more capable and sometimes also faster multi-chip packages than what can be achieved today. Samsung claims to have developed a first “through silicon via” (TSV) DRAM stack that soon could deliver 4 GB memory modules for the mainstream market.