Irvine (CA) – Gateway today announced one of the first quad-core PCs to become available in retail stores across the country. The systems are still carrying lofty price tags, but are substantially cheaper than the enthusiast quad-core PCs that have been available so far.
Gateway's FX desktop computer in detail ...
It has been about eleven months since AMD has revealed its Torrenza initiative, an effort to open up its hardware and encourage third parties to build secondary components, such as accelerators, around the firm’s processors. We haven’t heard much in the past months, but AMD says that Torrenza isn’t just a vision anymore.
Intel has informed its customers that the Core 2 Quad Q6600 desktop quad-core processor as well as the Xeon X3220 and X3210 server quad-core CPUs have been transitioned to a new stepping, which will allow customers to integrate the processors in computer systems using lower power flexible motherboards (FMB).
The "One Laptop Per Child" (OLPC) initiative planned to give notebooks computers to children at a $100 price tag, but that was apparently a little bit too cheap.
Intel is gearing up for its next-generation micro-processors. And we hear that Intel may be much closer to be releasing its 45 nm processors, code-named "Penryn", to production than we previously thought: Expect reviews and benchmarks of Penryn to surface early in Q3 of this year. Extra: Slideshow
Meeting its scheduled Q1 2007 launch, Hitachi announced that it has begun shipping the Deskstar 7K1000, the company's first commercially available 1 TB hard disk drive.
The good old Amiga system is could be resurfacing soon. Amiga and ACK Software Controls announced that the two firms are working on two new computers, one targeting a price point of $500 and another that will be aiming to attract performance-focused users and a budget of about $1500.
Hitachi today announced three new hard drive models targeting the enterprise market, including a fast 15K drive, a compact 2.5” model as well as a version of its high capacity terabyte drive.
Akita Elpida Memory, the DRAM backend production subsidiary of Elpida Memory, announced the development of a 1.4 mm-thick multi-chip package (MCP) with 20 stacked dies, claiming it as the world's thinnest MCP.
Seoul (Korea) – Stacking is the magic word that promises more capable and sometimes also faster multi-chip packages than what can be achieved today. Samsung claims to have developed a first “through silicon via” (TSV) DRAM stack that soon could deliver 4 GB memory modules for the mainstream market.
