Fujitsu Microelectronics Limited (FML) recently announced its new mobile WiMAX chipset optimized devices such as smart phones and PDAs. Sample shipment will start in August 2008. The chipset includes a baseband LSI (MB86K22), an RF LSI (MB86K52) and a power management LSI (MB39C316). The three devices are essential elements for competitive WiMax modules and were designed so that the size of the WiMAX module will be 12×12mm. The standby current - which has a direct impact on battery life - will not exceed 0.5mA, facilitating the development of attractive mobile WiMax terminals.
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