Micron bundles mobile DRAM and NAND flash
Barcelona (Spain) – Micron will begin offering memory solutions for cellphones that combine DRAM and NAND flash memory in one package.
The company introduced a new 78 nm, 1 Gb (128 MB) DRAM chip at the 3GSM Word Congress and confirmed that it will be offering the device also in combination with 1 Gb (128 MB), 2 Gb (256 MB) and 4 Gb (512 MB) NAND flash chips. The company claims that the multi-chip package (MCP) consumes less space than traditional, separate memory chips and opens the door for thinner cell phone designs.
Micro said that Micron will begin sampling the 1 Gb Mobile DRAM to customers this month, with mass production expected to ramp in the third quarter. The 1 Gb Mobile DRAM and 1 Gb NAND MCP will sample in the second quarter 2007 with the 2 and 4 Gb NAND MCPs following this summer.