For decades, electronic devices have been getting smaller, and smaller, and smaller. It’s now possible—even routine—to place millions of transistors on a single silicon chip.
Revenues for the global semiconductor market dropped two percent year on year to $295 billion in 2012, IDC's latest semiconductor application forecast reports.
The Semiconductor Industry Association (SIA) reports that first-quarter chip sales were up 0.9 percent compared to the same time last year.
Japan's Fujitsu is close to selling its mirocontroller chip business to Spansion.
The same material that formed the first primitive transistors more than 60 years ago can apparently be modified in a new way to advance future electronics.
TSMC, the world’s biggest foundry for hire, has seen its sales surge 18.9 percent in March from a year earlier
China has managed to overtake the US in semiconductor manufacturing and according to SEMI’s latest report, the trend is more than likely to accelerate, reports Quartz.
As chipmakers struggle to go beyond 22nm and 28nm, it seems older processes are dying faster than Gangnam Style. A recent report by IC Insights shows that more than a quarter of installed wafer capacity is dedicated to sub-40nm process geometries.
STMicro has been given some extra pocket money by the European Investment Bank, following it dumping the money pit chip venture STEricsson.
Scientists at IBM claimed today that it has cracked a materials conundrum that may well create a new class of memory and logic chips.
The global 3D integrated circuit market is forecast to grow by 19.7 percent between 2012 and 2016, with the major growth driver being strong demand for memory products, particularly flash memory and DRAM.
For the first time, semiconductors have been produced from graphene - a potential revolution for the electronics market. The Norwegian developers say products could be on the market in as little as five years.
Scientists and engineers at the University of Wisconsin-Milwaukee have discovered a completely new carbon-based material, synthesized from graphene, which could mark a big step towards faster electronics.
3M and IBM have kicked off a joint effort to develop the first adhesives capable of packaging semiconductors into densely stacked silicon "towers."
Researchers at the University of California, Berkeley, have developed an advanced method of growing nanolasers directly onto a silicon surface.
Globalfoundries has announced plans for a $3 billion expansion of its factories in New York and Germany.