Chicago (IL) – As the release of Intel’s 3-series chipsets and FSB1333 Core 2 Duo processors approaches, more system memory suppliers have been validated buy Intel to provide memory for its platform code-named “Bearlake”.
Elpida, Micron and Samsung are joining Hynix as the first wave of major memory suppliers who now say that they can ship DDR3 memory modules validated for Intel’s G33 reference platform. All four companies will be providing DDR3-800 and DDR3-1066 modules for the refreshed Core 2 Duos that are expected to launch during the Computex tradeshow.
Compared to DDR2, the DDR3 supply voltage has been reduced from 1.8V to 1.5V, reducing power consumption by up to 30% in memory modules with comparable clock speed. However, frequencies in DDR3 modules will go up quickly, bringing the back traditional levels of power consumption.
For example, Elpida said that it has (non-validated) DDR3-1333 modules available, with 1 Gb 70 nm devices that will enable DDR3-1600 modules “coming soon”. Samsung noted that a total of 21 of its DDR3 products have been validated by Intel. The company also hints to the introduction of DDR3-1333 devices: At the upcoming WinHEC 2007 Conference, the company will exhibit a enthusiast PC running on four 2 GB DDR3-1333 modules.
Micron will be offering 1 Gbit DDR3 modules manufactured in 78 nm, have a smaller die-size than the preceding 512 Mbit DDR2 chips, the firm said. A 2 Gbit DDR3 device is also expected to be available early next year. Micron did not say, which DDR3 module capacities it will offer, but said that its 1 Gb process meets “minimum system density requirements of 1 GB.”