STMicro, STATS ChipPAC and Infineon invest in 3D chip packages

  • STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop next-generation embedded wafer-level ball-grid array (eWLB) technology, based on Infineon's first-generation technology, for use in manufacturing future-generation semiconductor packages. STMicroelectronics and Infineon have joined forces with STATS ChipPAC, a leader in advanced three dimensional (3D) packaging solutions, to fully exploit the potential of Infineon's existing eWLB packaging technology, which has been licensed by Infineon to STMicroelectronics and STATS ChipPAC.

    More here at Digitimes.

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