Akita Elpida develops 1.4 mm MCP with 20 stacked dies

  • Akita Elpida Memory, the DRAM backend production subsidiary of Elpida Memory, announced the development of a 1.4 mm-thick multi-chip package (MCP) with 20 stacked dies, claiming it as the world's thinnest MCP. As portable devices shrink, demand for smaller memory package grows.

    More here at Digitimes.

Related Stories

5 Myths About Giving CBD To Pets

Sparkster– Next promising blockchain project claiming 10M TPS

Blockchain’s New Pair of Shoes