Akita Elpida develops 1.4 mm MCP with 20 stacked dies

Posted by DigiTimes

Akita Elpida Memory, the DRAM backend production subsidiary of Elpida Memory, announced the development of a 1.4 mm-thick multi-chip package (MCP) with 20 stacked dies, claiming it as the world's thinnest MCP. As portable devices shrink, demand for smaller memory package grows.

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