TSMC expects to enter 45nm production in September

  • Taiwan Semiconductor Manufacturing Company (TSMC) today announced that it would complete 45nm technology qualification and enter production as early as September 2007. The company stated its new 45nm process combines the most advanced 193nm immersion photolithography, competitive silicon strains, and extreme low-k (ELK) inter-metal dielectric material.

    More here at DigiTimes.

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