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First 3D processor built from the ground up PDF Print E-mail
Hardware
By Rick C. Hodgin   
Monday, September 15, 2008 10:20


University of Rochester professor Eby Friedman has developed a processor that literally takes chip design to another dimension. Whereas semiconductors today are physically manufactured in tiny 3D layers, their overall layout is conceived of and planned for in 2D, like a maze of circuits and logic units on a sheet of paper. Friedman said he has developed a prototype chip that is capable of operating at 1.4 GHz.

Read more at Design & Reuse.com.

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Sep 15, 2008 12:34     
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