Elpida and PSC to form JV on DRAM production in Taiwan

  • Elpida Memory and Powerchip Semiconductor Corporation (PSC) on December 7 jointly announced that both parties will establish a new joint venture (JV) company to operate DRAM fabrication facilities in the Central Taiwan Science Park (CTSP) with a total planned capacity of 240,000 12" wafers per month. At the same time, both parties have also agreed to jointly develop a part of next generation DRAM process technology. Both parties will be in an excellent position to collectively strive for the number one position in the DRAM industry, according to the companies.

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