Qimonda expands foundry agreement with Winbond

  • Qimonda and Winbond Electronics today announced that they have signed an agreement to expand their existing cooperation on the production of standard memory chips (DRAMs). Under the terms of the additional agreement, Qimonda will transfer its 80nm DRAM trench technology to Winbond's 300mm facility in Taichung.

    More here at DigiTimes.

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