Toshiba and SanDisk have signed a non-binding memorandum of understanding (MOU) on the reallocation of wafer output and equipment ownership and funding at their two joint ventures producing NAND flash memory on 300 millimeter wafers at Toshiba's Yokkaichi Operations in Japan, in response to a proposal from SanDisk. SanDisk expects to receive cash and reduce equipment lease obligations by approximately US$1 billion through this transaction.

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