Tokyo (Japan) - On Tuesday, Toshiba became the 7th member to join IBM's semiconductor alliance. Other members include AMD, Chartered, Freescale, Infineon, Samsung and STMicroelectronics. The alliance seeks to develop Silicon-On-Insulator (SOI) technology for the 32nm process node and beyond.
The group will divide the enormous development expenses associated with smaller features of future microprocessors among the members, while also bypassing expensive cross-licensing agreements for individually developed technology in future production applications. The alliance will develop everything necessary to allow full, mass production and manufacturing of future semiconductor products based on 32nm technology, currently scheduled for a 2010/2011 timeframe.
Read more ... Heise.de (in English).
The group will divide the enormous development expenses associated with smaller features of future microprocessors among the members, while also bypassing expensive cross-licensing agreements for individually developed technology in future production applications. The alliance will develop everything necessary to allow full, mass production and manufacturing of future semiconductor products based on 32nm technology, currently scheduled for a 2010/2011 timeframe.
Read more ... Heise.de (in English).
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